Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Hung Cheng Lin

Chi On Chui

Yung-Cheng Lu

Wan-Yi Kao

Che-Hao Chang

Chunyao Wang

Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Semiconductor device and method of manufacture

The present disclosure provides embodiments of semiconductor structures and method of forming the same. An example semiconductor structure includes a first source/drain feature and a second source/drain feature and a hybrid fin disposed between the first source/drain feature and the second source/drain feature and extending lengthwise along a first direction. The hybrid fin includes an inner feature and an outer layer disposed around the inner feature. The outer layer includes silicon oxycarbonitride and the inner feature includes silicon carbonitride.

Post-formation mends of dielectric features

A semiconductor device and method of manufacture are provided. In embodiments a dielectric fin is formed in order to help isolate adjacent semiconductor fins. The dielectric fin is formed using a deposition process in which deposition times and temperatures are utilized to increase the resistance of the dielectric fin to subsequent etching processes.

A board-mounted parallel circuit structure with efficient power utilization includes a first substrate, a first constant voltage layer and a second constant voltage layer. The first and second constant voltage layers are connected to a power supply respectively through two power connection points. The first constant voltage layer has at least one insulating zone. Each insulating zone has a light-emitting unit formed therein. One electrode of the light-emitting unit is connected to the first constant voltage layer, and the other electrode thereof is connected to the second constant voltage layer through a conducting wire. When the power supply outputs a low voltage to the first constant voltage layer, resistance values everywhere on the first constant voltage layer are identical. Accordingly, given any distance between a light-emitting unit and a corresponding power connection point, lighting efficiency of the light-emitting unit is not affected and effective power utilization can be ensured.

Board-mounted parallel circuit structure with efficient power utilization

A uniform luminance light-emitting diode (LED) circuit board includes a first primary trace and a second primary trace mounted on a substrate along a direction and are spaced apart, multiple LED strings mounted on the substrate along the direction and parallelly connected between the first primary trace and the second primary trace, a first power trace and a second power trace respectively connected to the first primary trace and the second primary trace, and a first auxiliary trace with two ends respectively connected to the second primary trace and the second power trace. By adjusting trace widths of the first primary trace and the second primary trace to limit current passing through each LED string and using the first auxiliary trace to provide an additional current path, identical current flowing through all the LED strings results in uniform luminance of the LED strings.

Uniform luminance light-emitting diode circuit board

A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns are oppositely formed on the electrical insulation board. Each wire pattern is connected to the corresponding power wire and has a matrix main loop having closed loops and a plurality of sub-wires formed inside the corresponding closed loop. A plurality of LEDs are respectively mounted on the corresponding closed loop and electrically connect with the two sub-wires of the two wire patterns. When a DC power supply is inputted to the power wires, a current of the DC power supply uniformly flows through the matrix main loop and the sub-wires, so that the LEDs electrically connected to the corresponding sub-wires receive approximately equal current to further emit light with uniform brightness.

Growing community of inventors

Hsinchu, Taiwan

Hung Cheng Lin