Nvidia Corporation

Acer Laboratories Inc.

Hung-Cheng Huang

Wen-Lung Cheng

An-Chung Chen

Ming-Tse Lin

I-Feng Chang

A bandgap reference circuit having a low sensitivity to temperature and supplied voltage installs a compensation circuit on a bandgap reference circuit to substitute a prior art that uses a resistor to match the circuit startup purpose and solve the problem of startup error caused by the manufacturing error. The bandgap reference circuit includes a first amplifier, a second amplifier, and a reference circuit having a plurality of transistors and a plurality of bipolar junction transistors, and the bandgap reference circuit is electrically connected to a same supplied power of which the reference circuit is electrically connected and also includes a plurality of transistors and a compensation circuit of the second amplifier, so as to output a stable startup voltage which has a low sensitivity to the change of temperature and the change of supplied voltage.

Bandgap reference circuit

A package of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the chip, in which the semiconductor chip is characterized at the bonding pads being positioned in at least four rows along each side of the chip, the four rows comprising an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads.

Growing community of inventors

Taipei, Taiwan

Hung-Cheng Huang