Advanced Semiconductor Engineering, Inc.

Hung Chen Kuo

Meng-Jen Wang

Wei Da Lin

Wen Jin Huang

Chien-Yuan Tseng

Ying-Hao Wei

Yuan-Long Chiao

Chia-Feng Hsu

A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

Semiconductor device package and method of manufacturing the same

A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.

Semiconductor package shielding structure

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Kaohsiung, Taiwan

Hung Chen Kuo