Xerox Corporation

Hung C Nguyen

Donald J Drake

Mark Anthony Cellura

Abdul M ElHatem

Mohammad M Mojarradi

A large array or pagewidth printhead fabricated from printhead elements or subunits. The printhead subunits are butted together at either adjacent channel elements or adjacent heater elements to form a pagewidth printhead. The butting element, either heater or channel element, is slightly wider than the non-butting element thereby providing gaps between the non-butting elements of a printhead element array. Where channel elements are used as the butting element, gaps between the heater elements provide for reduction or elimination of potentially damaging thermal compressive forces between adjacent heater elements. Where heater elements are used as the butting element, structural strength is increased since the heater wafer is stronger than the channel wafer. In addition, the width of the polyimide wall at the edges of the heater wafer is increased providing greater protection for thermal transducers located at the edges of individual heater elements.

Printhead element butting

A method in which several high voltage chips may be packaged within a single, typically low voltage plastic package. The high voltage chips are packaged to remain electrically isolated from each other to avoid undesirable side effects such as arcing between the chips but able to share electronic data and communicate with each other electronically through their input and ouput nodes. Due to the unique packaging method, the typically low voltage plastic packaging can be made to withstand operating voltages up to 35 times greater than previously attained by such low voltage plastic packaging.

Method of packaging a high voltage device array in a multi-chip module

A method for fabricating a liquid ink printhead orifice plate for use in a liquid ink printhead and printer. The liquid ink orifice plate is formed of a thermal plastic resin which is stamped between an orifice plate mandrel which includes the ink carrying features and a flat mandrel. Once the orifice plate has been stamped, excess material is removed from the orifice plate to reveal ink carrying features of the stamped orifice plate. The orifice plate mandrel is formed by electroforming a mandrel on an etched silicon wafer which defines a plurality of ink carrying channels and ink reservoirs. The electroform mandrel can be made of any number of metals which includes nickel.

Method of making a liquid ink printhead orifice plate

A large array or pagewidth printhead fabricated from printhead elements or subunits having adhesive-free butting edges. Each of the printhead elements includes a heater element and a channel element bonded together by an adhesive such as an epoxy. A space or adhesive-receiving aperture is formed between the channel element and the heater element before mating so that any adhesive forced from between the channel element and heater element by the pressure of mating does not flow onto the butting surfaces, but instead overflows into the space thereby maintaining an adhesive free butting edge. The channel element includes an etch trough which forms the space. The printhead elements are butted together to form a large array printhead. The absence of adhesive on the butting edges improves manufacturability of the large array printhead.

Growing community of inventors

Webster, NY, United States of America

Hung C Nguyen