Samsung Electronics Co., Ltd.

Hundae Choi

Garam Choi

Hwapyong Kim

Hojun Chang

Junha Lee

Yoochang Sung

Younggil Go

An offset calibration training method for adjusting a data receiver offset and a memory device therefor are provided. A method of performing a data receiver offset calibration includes storing a first parameter code, which is used to set a default data receiver offset calibration for the data receiver offset calibration, in a mode register, storing a second parameter code, which is used to set an optional data receiver offset calibration for the data receiver offset calibration, in the mode register, training the default data receiver offset calibration based on the first parameter code for the data receiver offset calibration, and training the optional data receiver offset calibration based on the second parameter code for the data receiver offset calibration.

Offset calibration training method for adjusting data receiver offset and memory device therefor

A semiconductor memory device includes a mode register set and a clock correction circuit. The mode register set stores a first control code set. During a duty training interval based on a duty training command, the clock correction circuit may divide the duty training interval into a first interval, a second interval and a third interval which are consecutive, may correct a phase skew of a first clock signal and a third clock signal during the first interval, may correct a phase skew of a second clock signal and a fourth clock signal during the second interval, and may correct a phase skew of the first clock signal and the fourth clock signal during the third interval. The semiconductor memory device may enhance signal integrity of clock signals by correcting duty errors and phase skews of the clock signals having multi-phases during the duty training interval.

Semiconductor memory device and memory system including the same

A duty adjustment circuit, and a delay locked loop circuit and a semiconductor memory device including the same are provided. The duty adjustment circuit includes a pulse generator configured to generate a pulse signal at a constant pulse width regardless of a frequency of a reference clock signal, based on frequency information, a code generator configured to generate a first predetermined number of delayed pulse signals by delaying the pulse signal, as a first code in response to the pulse signal, and a duty adjuster configured to receive a delay clock signal, and generate a duty correction clock signal by adjusting a slope of rising transition and a slope of falling transition of the delay clock signal in response to the first code and a second code.

Duty adjustment circuit, and delay locked loop circuit and semiconductor memory device including the same

A method of operating a memory device includes receiving a duty training request, performing first training for a write path in a first period, storing a result value of the first training, performing second training for a write path in a second period, storing a result value of the second training, transmitting the result value of the first training to an external device, and receiving a duty cycle adjuster (DCA) code value corresponding to the first training result value from the external device.

Memory device, memory system including the same and operating method thereof

A multi-phase clock generator includes first and second variable delay lines, a first phase splitter configured to phase-split a first phase-delayed clock, output from a clock tree, to output a first divided clock and a third divided clock, a second phase splitter configured to phase-split a second phase-delayed clock, output from the clock tree, to output a second divided clock and a fourth divided clock, a first duty cycle detector configured to detect a first duty error between the first divided clock and the third divided clock, and a second duty cycle detector configured to detect a second duty error between the second divided clock and the fourth divided clock. The first variable delay line is controlled according to the first duty error, and the second variable delay line is controlled according to the second duty error.

Multi-phase clock generator, memory device including multi-phase clock generator, and method of generating multi-phase clock of memory device

A clock locking method of a memory device, may include performing an initial locking operation in a delay locked loop circuit before an internal voltage is stabilized, monitoring clock skew between a reference clock and a feedback clock using a window detection circuit after the internal voltage is stabilized, and performing a re-locking operation in the delay locked loop circuit using a dynamic delay control corresponding to the clock skew.

Memory device and clock locking method thereof

A delay circuit of a delay-locked loop (DLL) circuit includes: a phase splitter configured to split a phase of a reference clock signal to output a first reference clock signal and a second reference clock signal having a phase difference of 180 degrees; a logic gate configured to delay the second reference clock signal to output a delayed reference clock signal; and a delay line circuit including a plurality of delay cells that are cascade-connected, the delay line circuit configured to delay the first reference clock signal and the delayed reference clock signal based on a control code set, and to output a first delayed clock signal and a second delayed clock signal having a delay amount corresponding to a delay of one logic gate included in the plurality of delay cells.

Delay circuit of delay-locked loop circuit and delay-locked loop circuit

A delay locked loop circuit and a semiconductor memory device are provided. The delay locked loop circuit includes a phase detection and delay control circuit configured to detect a phase difference between a first internally generated clock signal the feedback clock signal to generate a first phase difference detection signal in response to a first selection signal being activated, to detect a phase difference between a second internally generated clock signal and the feedback clock signal to generate a second phase difference detection signal in response to a second selection signal being activated, and to change a code value in response to the first phase difference detection signal or the second phase difference detection signal.

Delay locked loop circuit and semiconductor memory device having the same

A delay locked loop circuit including: a clock signal input buffer to buffer an input clock signal and generate a reference clock signal; a delay unit to delay the reference clock signal in response to a coarse and fine delay code and generate an internal clock signal; a clock signal delay replica unit to delay the internal clock signal and generate a feedback clock signal; a coarse delay control unit to receive the reference and feedback clock signals, detect a time period between a transition time point of the reference clock signal and a transition time point of the feedback clock signal occurring before the transition time point of the reference clock signal, and generate a coarse delay code; and a fine delay control unit to compare a phase of the reference clock signal and a phase of the feedback clock signal, and generate a fine delay code.

A memory device includes a calibration circuit having a pull-up code generator including a pull-up resistor block and generating a pull-up code, and a pull-down code generator including a replica pull-up resistor block and a pull-down resistor block and generating a pull-down code, and an off chip driver/on die termination circuit providing a termination resistance having a resistance value set by the calibration circuit in a data reception operation and outputting data at an output strength set by the calibration circuit in a data output operation. In a calibration operation, a resistance value of the replica pull-up resistor block is adjusted to be less than a resistance value of the pull-up resistor block, and the pull-down code has a code value by which a resistance value of the pull-down resistor block corresponds to the resistance value of the replica pull-up resistor block.

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Hwaseong-si, South Korea

Hundae Choi