Samsung Electronics Co., Ltd.

Hun Taek Han

Seong-Chan Han

Tae Ho Kim

Hyuk Kang

Dong-Woo Shin

Jae-Hoon Choi

Hyun Woo Park

Young-Soo Lee

Hyo-Jae Bang

Han-Ju Kim

Chang-Yong Park

Gyu Tae Choi

Hyun-Jong Oh

Tae Gun Park

Woo Jin Jun

Hyun Sang Jung

Jae-chan Lee

Young-Rock Lee

Chan-Hyung Yun

A dispenser includes a syringe container having a first end and a second end, the syringe container having a length direction extending between the first end and the second end, a plunger movable within the syringe container along the length direction of the syringe container and configured to be positioned on a surface of an underfill solution to be received within the syringe container at a first region between the plunger and the second end, a cap attached airtightly to the first end of the syringe container, a first gas supply line configured to supply a first gas into the syringe container through the cap, and a second gas supply line extending from the cap to the plunger, the second gas supply line being in fluid communication with the first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.

Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same

An electronic device is provided. The electronic device includes a camera, a communication circuit configured to communicate with an external electronic device, and a processor. The processor is configured to obtain an image using the camera, verify location information of the image, obtain identification information of the external electronic device from the external electronic device if the location information of the image is not verified, and determine the location information of the image based on the identification information of the external electronic device.

Image processing method and electronic device supporting the same

A semiconductor package includes a substrate having a groove in an upper surface. A semiconductor device is mounted on the substrate to cover one portion of the groove and leaving another portion exposed.

Semiconductor package

A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Router apparatus

An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Method of fabricating an electronic device

Growing community of inventors

Gyeonggi-do, South Korea

Hun Taek Han