Pixart Imaging Incorporated

Fairchild Semiconductor Corporation

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Semiconductor Components Industries, LLC

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies General IP Pte, Ltd.

Hun Kwang Lee

Sai Mun Lee

David Chong

Chee Foo Lum

Li Chong Tai

Yat Kheng Leong

Howard Allen

Stephen Martin

Lye Pin Chu

Khoon Guan Tee

A/l Gopal Krishnan Thineshwaran

Ing Hong Ooi

Yee Loong Chin

An optical navigation device includes a casing, a circuit board, an illumination light source and an optical receiver. The casing is movably located above a navigation surface. The circuit board is disposed inside the casing. The illumination light source is disposed on the circuit board and adapted to provide an illumination channel toward the navigation surface. The optical receiver is disposed adjacent to the illumination light source. An imaging channel of the optical receiver is substantially parallel to a planar normal vector of the navigation surface, and the optical receiver is adapted to identify features on the navigation surface within a range crossed by the imaging channel and the illumination channel for providing navigation information.

Optical navigation device

A distance detection device includes a light source, a light guiding component, an image sensor and a processor. The light guiding component is disposed adjacent to the light source and includes a discontinuous surface. The light guiding component is adapted to project a beam emitted from the light source onto an object to form an illuminating pattern spotted by the discontinuous surface. The image sensor is adapted to capture an image about the object. The processor is electrically connected with the image sensor and utilized to analyze position variation of a spot formed by the discontinuous surface within the image for determining a distance of the object.

Distance detection device

An optical finger navigation (OFN) device for use in handheld portable devices is presented. The OFN device may include a light source, a sensor, a lens holder integrated with a light guide system and a molded lead frame. The lens holder may include a lens receiving region for receiving the lens, a light guide system for directing light emitted by the light source towards the navigation surface. The light guide system may include a slanted wall that may be coated with a light reflective material.

Optical finger navigation device

An optical finger navigation (OFN) device includes an OFN sensor module, a light source, and a vertical light guide. The OFN sensor module is coupled to a circuit substrate. The OFN sensor module generates a navigation signal in response to a movement detected at a navigation surface based on light reflected from a user's finger. The light source is also coupled to the circuit substrate. The light source generates light (which is separate from the light generated for the OFN sensor module). The vertical light guide is disposed to circumscribe a perimeter of the OFN sensor module. The vertical light guide receives the light from the light source and guides the light toward a light emission surface at a perimeter surface area circumscribing the navigation surface.

Backlighting for optical finger navigation

A semiconductor integrated circuit (IC) device is defined by a low-profile package without a die attach pad (DAP). In place of the DAP, an adhesive element is used to retain a die relative to a lead frame during processing. In one example, a method of manufacturing the device includes sealing the lead frame on one side using an adhesive tape and exposing a portion of the tape within a die attach region. The die is secured onto the tape adhesive and held in place during subsequent processing, such as a wire bonding procedure to couple the die to external portions of the frame.

Systems and methods for low profile die package

A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space navigation sensor. The circuit board mechanically supports and electrically connects multiple navigation sensors on opposing sides of the circuit board. The contact navigation sensor is coupled to a first side of the circuit board. The contact navigation sensor generates a contact navigation signal based on contact navigation images of a contact navigation surface approximately adjacent to the dual-channel optical navigation system. The free-space navigation sensor is coupled to a second side of the circuit board. The free-space navigation sensor generates a free-space navigation signal based on free-space navigation images of an operating environment of the dual-channel optical navigation system.

Dual-channel optical navigation device

A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that has pre-formed gull-wing leads only on the source/gate side of the chip. A boschman molding technique is used for the encapsulation process, leaving exposed land and die bottoms for a direct connection to a circuit board. The resulting packaged IC chip has the source of the chip directly connected to the lead frame by solder balls. As well, the drain and gate of the chip are directly mounted to the circuit board without the need for leads from the drain side of the chip.

Packaging system for semiconductor devices

A system for optical navigation includes an optical navigation sensor integrated circuit (IC) configured to generate image information for use in navigation sensing and a collapsible structure which sets the distance between the optical navigation sensor IC and a navigation surface and which can be expanded or collapsed as needed. The collapsible structure includes a collapse system configured to allow the collapsible structure to be in an expanded state or a collapsed state. The collapse structure has a smaller profile dimension in the collapsed state than in the expanded state. The collapsible structure is placed in the expanded state for navigation sensing and in the collapsed state for storage and/or charging.

Collapsible structure for optical navigation system

An apparatus having a coherent light source, an optical sensor, and a controller that can be utilized in optical mice and the like is disclosed. The coherent light source emits coherent light in a cone of angles about an illumination direction. The optical sensor includes an array of photodetectors disposed on a die having a surface substantially perpendicular to the illumination direction. The controller compares first and second images recorded by the optical sensor at different times and determines a displacement indicative of the direction and distance the apparatus has moved between the two different times. A portion of the coherent light source is bonded to the die at a location within the array of photodetectors.

Low profile optical navigation sensor

In one embodiment, conductors of a semiconductor device are routed to a contact platform of the semiconductor device by using electroless plating and screen-printing techniques.

Method of routing an electrical connection on a semiconductor device and structure therefor

A die attach package for connecting a die or chip of die-down orientation to a printed circuit board in a die-up orientation. The package includes a substrate with leads that may be traces terminating in vias or that may be the leads of a lead frame. The traces or the leads of the lead frame are modified such that they pass under the die when the die is attached. The traces or leads are routed under the die such that proper connections are established from the topside of the die to the appropriate mount locations of the printed circuit board. The die is attached to the substrate using a non-electrically-conductive material. This packaging enables a fabricator to make die of one orientation type, die down, and use that die in a die-up package, thereby saving on fabrication costs.

Growing community of inventors

Penang, Malaysia

Hun Kwang Lee