Samsung Electro-mechanics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electronics Co., Ltd.

Hun Joo Hahm

Young Sam Park

Hyung Suk Kim

Young June Jeong

Jung Park

Seong Yeon Han

Dae Yeon Kim

Ho Sik Ahn

Chul Hee Yoo

Young Ho Park

Do Hun Kim

Seon Goo Lee

Kyung Taeg Han

Dae Hyun Kim

Chang Ho Song

Chang Ho Shin

Bum Jin Kim

Jae Ho Shin

Soo Min Lee

Seung Jin Yoo

In Eung Kim

Dong Hyun Cho

Ho Yeon Kim

Jeong Seok Na

Je Won Kim

In Tae Yeo

Dae Cheon Kim

Dong Joon Kim

Won Joon Lee

Bang Won Oh

Sun Woon Kim

Masayoshi Koike

Kun Yoo Ko

Myoung Soo Choi

Seung Ick Lee

Yoon Sung Na

Min Gyu Kim

Dong Woo Kim

Jin Ha Kim

Chul Soo Yoon

Young Jae Song

Ho Seop Jeong

Sang Hyuck Lee

Seok Min Hwang

Young Sik Jeong

Jin Jong Kim

Seong Ah Joo

Chon Su Kyong

Hyung Jin Park

Joo Hee Jun

Ji Hyun Lim

Ho Sik Anh

Hyun Bae Park

Subedi Rabindra

Hyo Kyong Cho

Yuiji Imai

Giun Lim

J Ong Seok Na

Jae Hong Shin

A light emitting device includes: a substrate; a light emitting element mounted on the substrate and emitting blue light and green light; and a wavelength conversion part wavelength-converting a portion of light emitted from the light emitting element into red light, and including fluoride-based phosphors represented by Chemical Formula: AMF:Mn(2&#x2266;x&#x2266;3 and 4&#x2266;y&#x2266;7, where element A is at least one selected from a group consisting of Li, Na, K, Rb, and Cs and element M is at least one selected from a group consisting of Si, Ti, Zr, Hf, Ge and Sn) and organic or inorganic coating layers enclosing the fluoride-based phosphors.

Light emitting device, backlight unit and display apparatus

A light emitting device package includes a reflective unit having a first surface and a second surface opposing the first surface and having a through hole formed in a central portion of the reflective unit to penetrate through the first and second surfaces, a light emitting device disposed in the through hole and externally exposed to one of the first and second surfaces, and an optical device disposed on the first surface of the reflective unit to cover the light emitting device. The optical device allows light generated by the light emitting device to be partially transmitted and partially reflected to be emitted externally.

Light emitting device package and lighting device having the same

Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.

Backlight unit

A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

White light emitting device and white light source module using the same

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Light emitting diode package and fabrication method thereof

There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.

Light emitting diode package and method of manufacturing the same

There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Light emitting module

Provided are a nitride semiconductor light-emitting device comprising a polycrystalline or amorphous substrate made of AlN; a plurality of dielectric patterns formed on the AlN substrate and having a stripe or lattice structure; a lateral epitaxially overgrown-nitride semiconductor layer formed on the AlN substrate having the dielectric patterns by Lateral Epitaxial Overgrowth; a first conductive nitride semiconductor layer formed on the nitride semiconductor layer; an active layer formed on the first conductive nitride semiconductor layer; and a second conductive nitride semiconductor layer formed on the active layer; and a process for producing the same.

Nitride semiconductor light-emitting device and process for producing the same

There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles &#x3b8; satisfying the condition of 45&#xb0;&#x2266;&#x3b8;&#x2266;55&#xb0; therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm&#x2266;P&#x2266;29 mm, and a pitch Pbetween the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm&#x2266;P&#x2266;38 mm.

Plane light source and LCD backlight unit having the same

The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.

Light emitting diode package including a lead frame with a cavity

There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.

Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same

Growing community of inventors

Kyungki-do, South Korea

Hun Joo Hahm