Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Hun Heo

Byung-Duck Park

Keum-Chul Kim

A semiconductor integrated circuit comprising: a first macro cell including a first power line in a first wiring layer; a second macro cell adjacent to the first macro cell, the second macro cell including a second power line in the first wiring layer; a first connection part in the first wiring layer, the first connection part electrically connecting the first power line with the second power line; and a third power line in a second wiring layer different from the first wiring layer, the third power line electrically connected to the first power line; wherein the second power line is electrically connected to the third power line through the first connection part.

Semiconductor integrated circuit and electronic system including the same

A system-on-chip includes a substrate, a plurality of unit cells on the substrate, a first power mesh, and a second power mesh. The first power mesh includes a power rail that is connected to power terminals of the plurality of unit cells and is provided in a first metallization layer. The first power mesh also includes a power strap in a second metallization layer. The second power mesh is provided in a third metallization layer and a fourth metallization layer.

System-on-chip, electronic apparatus including the same, and method of designing the same

A slide module includes a base, at least one rail receiving part is formed; a slider includes at least one rail part slidably and facing the base; and a friction reducing unit formed on at least one of the base and the slider to reduce friction generated when the slider is slidably moved over the base. The sliding operation can be more smoothly and silently performed.

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Seoul, South Korea

Hun Heo