Fairchild Semiconductor Corporation

Huiyong Luke Chung

Yong Liu

Qiuxiao Qian

Mike Speed

JungTae Lee

JiangYuan Zhang

A molded, leadless packaged semiconductor multichip module includeshas four mosfetsfor a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or four mosfets of the same type, but four N-channel are preferred. In modulethere are two leadframesfor assembling the mosfets. In particular, the two N-channel and two P-channel devices are disposed between two leadframes and encapsulated in an electrically insulating molding compound. The resulting package has four upper heat sinks-that are exposed in the molding compoundfor transferring heat from the mosfets to the ambient environment. No wire bonds are required. This can significantly reduce the on resistance, RDS. The top or source-drain lead framemay be soldered to the sources and gates of the bridge mosfets.

Growing community of inventors

Yongin, South Korea

Huiyong Luke Chung