Samsung Electronics Co., Ltd.

Huiteak Hong

Boun Yoon

Ilyoung Yoon

Kangchun Lee

Joongsuk Oh

Junhwan Yim

A semiconductor device manufacturing method is capable of manufacturing a semiconductor device with improved reliability, by simplifying a chemical mechanical polishing (CMP) process and minimizing a thickness distribution of a dummy gate during the CMP process. The semiconductor device manufacturing method includes forming, on a substrate, dummy gate structures extending in a first direction and spaced apart from each other in a second direction perpendicular to the first direction, each dummy gate structure including a dummy gate and a mask pattern on an upper surface of the dummy gate; forming an interlayer insulating layer covering the dummy gate structures; and performing the single slurry CMP process of removing some of the interlayer insulating layer and the dummy gate structures through the single slurry CMP process and exposing the upper surface of the dummy gate.

Growing community of inventors

Yongin-si, South Korea

Huiteak Hong