Taiwan Semiconductor Manufacturing Comp. Ltd.

Huilin Chang

Yung-Cheng Lu

Chen-Hua Douglas Yu

Shwang-Ming Jeng

Ting-Yu Shen

Yichi Liao

Mong-Song Liang

An integrated circuit device having at least a bond pad for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.

Integrated circuit device

Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.

Bond pads and methods for fabricating the same

An integrated method comprises providing a low dielectric material, applying a first treatment altering a first property of the low dielectric material, and applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability.

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Hsin-Chu, Taiwan

Huilin Chang