Boe Technology Group Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

Huawei Technologies Co., Limited

Beijing Boe Technology Development Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Huijuan Wang

Xue Dong

Xiaochuan Chen

Minghua Xuan

Shengji Yang

Fei Wang

Guangcai Yuan

Zhanfeng Cao

Ke Fei Wang

Zhijun Lv

Zhiwei Liang

Pengcheng Lu

Yonglian Qi

Haixu Li

Jing Yu

Yingwei Liu

Zhenhua Lv

Meili Wang

Zezhou Yang

Lei Wang

Wei Wang

Wei Liu

Hui Wang

Qi Yao

Dongni Liu

Li Xiao

Xiandong Meng

Yun Qiu

Lianjie Qu

Yingzi Wang

Hebin Zhao

Yanming Wang

Xinhong Lu

Guoqiang Wang

Zhaokun Yang

Ruiyong Wang

Yang You

Hsuanwei Mai

Weifeng Han

Jifeng Tan

Liang Chen

Shi Shu

Dan Wang

Han Yue

Xianqin Meng

Xiao Lin Sun

Tao Liu

Yafeng Yang

Fang Liu

Bin Hu

Jie Fu

Dejiang Zhao

Detao Zhao

Shuai Liu

Ke Wang

Wenqian Luo

Wanxian Xu

Ruizhi Yang

Bingqiang Gui

Yunyun Tian

Hongshu Zhang

Xuan Liang

Minqi Chen

Jinsen Cai

Yingli Liu

Tian Zhao

Bo Kong

Limin Yu

Huipeng Guo

A display substrate includes: a first substrate, a second substrate, a liquid crystal layer, a plurality of pixel electrodes, and a plurality of light-emitting elements. The plurality of pixel electrodes and the plurality of light-emitting elements are both disposed on a side, proximal to the liquid crystal layer, of the first substrate.

Display substrate, control method thereof, and display device

Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Display backplate and method for manufacturing same, display panel and method for manufacturing same, and display device

A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.

Shielding structure for system-in-package and electronic device

A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

Display backplane and method of manufacturing the same, display device

The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

Mass transfer method and system for micro light emitting diodes

The present disclosure relates to the field of LED display technologies, and provides an LED chip, an LED light emitting substrate, a display device and a control method thereof. Specifically, the LED chip comprises: an N-type semiconductor layer, a P-type semiconductor layer, as well as a quantum well layer between the N-type semiconductor layer and the P-type semiconductor layer. The quantum well layer is made of indium gallium nitride, wherein indium atoms have a molar ratio of greater than or equal to 0.3 in the indium gallium nitride.

LED chip, LED light emitting substrate, display device and control method thereof

A backlight source is provided which includes a light guide plateand a light-emitting unit. The light guide plateincludes a first surface and a second surface disposed oppositely. The light-emitting unitis located on the side of the light guide plate where the first surface disposed. The grating layerincludes at least one grating unit configured to diffract light emitted by the light-emitting unit. The overall structure of the backlight source is no longer limited by the distance between the LEDs and the first layer diffusion layer, and therefore the thinning and lightening of the backlight source is realized. A manufacturing method of a backlight source and a display device are further provided.

Backlight source and manufacturing method thereof, and display device

A pixel unit circuit includes a light emitting element, a first end thereof being coupled to a low level input end; a storage capacitor module, a first end thereof being coupled to a direct current voltage input end; a driving transistor, a gate electrode thereof being coupled to a second end of the storage capacitor module, and a first electrode thereof being coupled to a second end of the light emitting element; a first control module, coupled to a gate line, a data line and the gate electrode of the driving transistor, configured to control whether the gate electrode of the driving transistor is connected to the data line under the control of the gate line; and a potential control transistor, a gate electrode and a first electrode thereof being coupled to the first electrode of the driving transistor, the second electrode thereof being grounded.

Pixel unit circuit, pixel circuit, method for driving pixel circuit and display device

The present disclosure provides a pixel circuit and a drive method thereof, and a touch display apparatus. The pixel circuit includes a pixel driving circuit, an optical sensing circuit, and a light-emitting element. The pixel driving circuit is configured to drive the light-emitting element to emit light, based on a first control signal from a first control line, a second control signal from a second control line, a scanning signal from a scanning line, and a data signal from a data line. The optical sensing circuit is configured to sense an optical signal, convert the sensed optical signal into an electric signal, and output the electric signal via a reading line based on the first control signal, the second control signal, the scanning signal, and the data signal.

Pixel circuit, method, and AMOLED display with optical touch sensing

A light guide plate, a backlight module and a display device are provided. A plurality of blind holes is arranged at a surface of the light guide plate; the blind hole is filled with a light-converting unit; the light-converting unit includes an accommodating cavity made of a light-transmitting material, and a light-converting material located in the accommodating cavity; and a gap is between an outer wall of the accommodating cavity and an inner wall of the blind hole.

Light guide plate, backlight module and display device

Disclosed are an array substrate, and a display device, and a method for manufacturing the same. The array substrate includes: a base substrate, and a thin film transistor, a planarization pattern, a bonding pattern, and a conductive structure that are disposed on the base substrate. The thin film transistor, the planarization pattern, and the bonding pattern are laminated in a direction going distally from the base substrate. The planarization pattern is provided with a via and a groove, the conductive structure is disposed in the via, wherein the bonding pattern is conductive and is electrically connected to the thin film transistor by the conductive structure, an orthographic projection of the bonding pattern on the base substrate falls outside an orthographic projection of the groove on the base substrate, and the groove is configured to accommodate an adhesive.

Array substrate, display device, and method for manufacturing same

A organic light-emitting display panel, a preparation method of the organic light-emitting display panel and a display device are provided. The preparation method of the organic light-emitting display panel includes: providing a base substrate; forming a plurality of touch electrode wirings, an organic functional layer, and a plurality of first electrodes sequentially on the base substrate, the plurality of the touch electrode wirings being electrically insulated from each other, the plurality of the first electrodes being electrically insulated from each other, and the plurality of the touch electrode wirings and the plurality of the first electrodes are in one-to-one correspondence, forming a first encapsulation structure on the plurality of the first electrodes, and then using a laser irradiation process to electrically connect the respective first electrodes with the touch electrode wirings corresponding thereto by via holes passing through the organic functional layer.

Organic light-emitting display panel and preparation method thereof, and display device

A backlight includes a plurality of light sources of at least three different colors disposed on a base substrate, and a plurality of grating units that are disposed on a light exit side of the plurality of light sources and are in one-to-one correspondence with the plurality of light sources. Each of the plurality of grating units is used for splitting light emitted by a corresponding one of the plurality of light sources to form in an array of uniformly distributed monochromatic spots, so that the backlight may form an array of colored spots in which at least three different colors of light spots are alternately arranged in sequence along a first direction, wherein the first direction is a row direction or a column direction of the array of colored spots.

Backlight and liquid crystal display device

A micro device transferring apparatus and a micro device transferring method are provided. The micro device transferring apparatus for moving a micro device fixed on an original substrate to a target substrate includes: a stripper on a side of the original substrate away from the micro device, configured to strip the micro device off the original substrate, and an optical tweezer configured to tweeze the micro device from a side of the original substrate provided with the micro device, wherein an accommodating space for accommodating the micro device and the original substrate is between the stripper and the optical tweezer.

Micro device transferring apparatus and micro device transferring method

Growing community of inventors

Beijing, China

Huijuan Wang