Osram Opto Semiconductors Gmbh

Hui Ying Pee

Wing Yew Wong

Mei See Boon

Sok Gek Beh

Tomin Liu

Asliza Alias

Hui Chiang Teoh

Yuan Liang

Alex Kheng Hooi Lim

Lay Teng Tan

In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.

Leadframe and chip package comprising a leadframe

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Bayan Lepas, Malaysia

Hui Ying Pee