Harvatek Corporation

J.s. Technology Co., Ltd.

Hui Yen Huang

Bily Wang

Jonnie Chuang

Wen-Ho Chen

King Chang Chang

Chia-Feng Lin

Yu Hsi Wang

Hsin I Lu

Chia Pin Chang

An LED package structure without pre-stored power sources includes a substrate unit and a LED chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin. The positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential. The negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential. The LED chip is disposed on the carrier substrate and electrically connected between the positive conductive pin and the negative conductive pin. Both the positive conductive pin and the negative conductive pin concurrently contact a predetermined liquid for generating oxidation-reduction reaction so as to generate electric powers with a predetermined driving voltage, and the LED chip is driven by the electric powers with the predetermined driving voltage for generating an indicator light source. The instant disclosure further provides a portable light-emitting device without pre-stored power sources.

Portable light-emitting device without pre-stored power sources and LED package structure thereof

A white light LED assembly has at least two kinds of light-emitting units. The units can be a white light-emitting unit composed of red, green and blue LEDs, a white light-emitting unit composed of a blue and yellowish-green LEDs, a white light-emitting unit composed of a blue LED and yellow phosphor, or a white light-emitting units composed of UV LED and red, green and blue phosphors. The white light LED assembly according to the present invention has satisfactory efficiency and color rendering property as well as flexible phosphor usage.

White light LED assembly

A BLU module has a plurality of BLUs assembled together. Each of the BLUs includes a light guide, a light source structure adjacent to the light guide, and a heat conduction member contacting the light source structure. The light guide has a light-emitting surface arranged on a top thereof and a bottom surface opposing the light-emitting surface, the light-emitting surface being larger than the bottom surface so that that light guide defines a first cavity formed therebetween. The light source structure is received in the first cavity. The light guide in two adjacent BLUs of the module defines a second cavity opposite the first cavity for receiving an adjacent heat conduction member of a prior adjacent light guide. The module is provided with a variable size with the BLUs assembled together to meet requirements.

BLU and module using the BLU

Metal base design for surface mount device LED

Light-emitting diode

Growing community of inventors

Hsinchu, Taiwan

Hui Yen Huang