Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Avago Technologies International Sales Pte. Limited

Hui Xu

David J K Meadowcroft

Seng-Kum Chan

Ye Chen

Paul Yu

Chaitanya Arekar

Robert G Ritter

Pengyue Wen

Sanjeev Gupta

Poorya Saghari

Ron Kaneshiro

Guobin Liu

Bob Ritter

Jianping Su

An-Nien Chen

In an optical communications system, the thermal pathway for dissipating heat generated by clock and data recovery (CDR) circuitry of an optical communications module is a separate from the thermal pathway that is used to dissipate heat generated by other components of the module. The CDR circuitry is external to the module and is provided with its own heat dissipation device. Keeping the CDR circuitry external to the module and providing it with its own heat dissipation device decouples the thermal pathway for dissipating heat generated by the CDR circuitry from the thermal pathways used for dissipating heat generated by other components of the module. This results in more effective heat dissipation and better component performance.

Methods and systems for dissipating heat in optical communications modules

A heat dissipation system for an optical communications module is provided that includes a cold block on which the optoelectronic components and a lens assembly of an OSA of the module are mounted. The cold block has precisely-controlled mounting surface heights that precisely passively align the lens assembly in directions normal to mounting surfaces of the cold block. The cold block is made of a material of very high thermal conductivity, typically copper, so that heat generated by the optoelectronic components is dissipated into the cold block to maintain the optoelectronic components well below maximum allowable temperatures. In addition, an optical interface device of the OSA has a low-profile and an optical configuration that allows it to be used with a high optical fiber count.

Methods, devices and systems that dissipate heat and facilitate optical alignment in optical communications modules

A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.

Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

A flexible dust cover is provided for use with a parallel optical communications module for preventing airborne matter, such as dirt, dust, and gases from entering the module. The flexible dust cover fits snugly to the module to protect components of the module and the optical pathways of the module from airborne matter. The flexible dust cover has an elasticity that allows it to be temporarily deformed from its original shape to a stretched state by application of a stretching force to enable the module to be inserted into a central opening formed in the cover. The force is then removed, causing the cover to attempt to return to its original, non-stretched shape. When this happens, interior surfaces of the cover form a snug fit about exterior surfaces of the module. This snug fit fills in air gaps in the module that would otherwise be exposed to the environment.

Flexible dust cover for use with a parallel optical communications module to prevent airborne matter from entering the module, and a method

An opto-electronic system includes a substrate, an opto-electronic chip mounted on the substrate, a frame, and a lens device retained in the frame. A frame mounting portion of the frame is in contact with an upper surface of the opto-electronic chip. A lens mounting portion of the frame is spaced above the frame mounting portion. A lower surface of the lens device is in contact with the lens mounting portion. The spacing of the lens mounting portion and frame mounting portion determines the spacing between the upper surface of the opto-electronic chip and the lower surface of the lens device.

Lens standoff and protection for optical communication systems

A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA.

Parallel optical communications device having weldable inserts

A method and an apparatus are provided for use in a parallel optical transmitter or transceiver to compensate for variations in optical crosstalk in an optical output power monitoring system that are caused by lasers being enabled and/or disabled. In particular, the method and apparatus cause adjustments to be made to the reference value of each optical channel based on determinations of whether one or more lasers of the other optical channels have been disabled or enabled. By making these adjustments, the average optical output power level of each laser of each channel can be maintained at a desired or required level even if one or more of the lasers of one or more of the other channels is enabled or disabled.

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Santa Clara, CA, United States of America

Hui Xu