Industrial Technology Research Institute

Hui-Wen Chang

Kuo-Chan Chiou

Yen-Chun Liu

Chen-Lung Lin

Hsien-Lin Hu

Min-Chian Wang

Hsiang-Yen Tsao

A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, Xis Xis m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

Thermally conductive resin and thermal interface material comprising the same

An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4&#x2032;-ethylenedianiline, 4,4&#x2032;-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

Epoxy resin compositions and thermal interface materials comprising the same

A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25&#xb0; C. to 2,900&#xb0; C.

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Hui-Wen Chang