Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Hui Ping Duan

Kun Peng

A physical unclonable function (PUF) chip is provided. The physical unclonable function (PUF) chip includes a chip with a top metal connection layer, an array of spaced electrode plates on the top metal connection layer of the chip, a deposition layer, on the top metal connection layer between each two adjacent electrode plates. An opening is formed between the each two adjacent electrode plates in a row, and each two adjacent electrode plates are tangential to the opening formed between the two adjacent electrode plates. The physical unclonable function (PUF) chip further includes a conductive coating layer on the chip and the conductive coating layer includes conductive particles with randomly distributed size, and a package substrate, packaged with the chip including the conductive coating layer.

Physical unclonable function (PUF) chip

A physical unclonable function (PUF) chip and a fabrication method are provided. The fabrication method includes: forming an array of spaced electrode plates on a top metal connection layer of a nude chip, while forming the top metal connection layer; forming a deposition layer, on the top metal connection layer between adjacent electrode plates; forming openings between adjacent electrode plates in a row, each opening having a circumference tangent to the adjacent electrode plates; coating a conductive coating layer on the nude chip, the conductive coating layer including conductive particles with randomly distributed size; and packaging the nude chip to provide the PUF chip.

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Shanghai, China

Hui Ping Duan