Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies General IP Pte, Ltd.

Hui Peng Koay

Kee Yean Ng

Kheng Leng Tan

Keat Chuan Ng

Chiau Jin Lee

Wei Liam Loo

Thye Linn Mok

Yew Cheong Kuan

Kian Shin Lee

Norfidathul Aizar Abdul Karim

Chee Wai Chia

Aizar Abdul Karim Norfidathul

Fakhrul Arifin Mohd Afif

Hong Huat Yeoh

Elizabeth Ching Ling Fung

Lye Yee Wong

Alzar Abdul Karim Norfidathul

A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.

Light emitting diode package with direct leadframe heat dissipation

In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they primarily emit light away from the substrate. The light emitters are then covered with a transparent to translucent encapsulant; and the encapsulant is coated with a reflective material that reflects light emitted by the light emitters toward the substrate. Related apparatus is also disclosed.

Method and apparatus for mixing light emitted by a plurality of solid-state light emitters

A light emission device. A lead frame comprises a first lead frame segment and a second lead frame segment. A light source is coupled to the first lead frame segment. A wire bond is coupled to the light source and coupled to the second lead frame segment. A translucent epoxy cast encases the light source, the wire bond and a portion of the lead frame.

Light emission device

Growing community of inventors

Penang, Malaysia

Hui Peng Koay