Taiwan Semiconductor Manufacturing Comp. Ltd.

Hui-Ming Chu

Ming-Tzung Hsu

Cho-Ching Chen

Chiang-Jeh Chen

Paul Tan

Fu-Hsing Shen

Bor-Hann Hsieh

Jeng-Lian Lin

A slurry dispensing system comprises a first supply station, a second supply station, a first loop, a second loop, a first valve and a second valve. The first loop is selectively connected to the first supply station and the second supply station. The second loop is also selectively connected to the first supply station and the second supply station. The first valve connects the first loop to points of use. The second valve connects the second loop to the points of use. When slurry is supplied to the first loop from the first slurry station, slurry is supplied to the second loop from the second slurry station. When the first valve is opened and the second valve is closed, slurry is supplied to the points of use from the first loop.

Slurry dispensing system

A method and an apparatus for preventing silicon hole defect formation on a silicon wafer after a wet cleaning process are disclosed. In the method, a supply tank and a cleaning tank are provided which are connected together in fluid communication by a conduit. The conduit is cooled by a wrapped around cooling tube and a cooling water flowing through the tube at a temperature of less than 20&deg; C. The apparatus of the wet cleaning station may further include a pump for transporting an aqueous solution of ammonia from the supply tank to the cleaning tank, a safety overflow conduit for protecting the supply tank that holds the aqueous solution of ammonia, and a flow control valve in the conduit between the supply tank and the cleaning tank. The present invention novel method and apparatus effectively prevents the formation of ammonia vapor in the mini-environment that surrounds the cleaning tank and the rinse tank. The silicon hole defect frequently found on the surface of a wafer caused by attacks from concentrated aqueous solution of ammonia can be avoided.

Method and apparatus for preventing silicon hole defect formation after wet cleaning

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Hsinchu, Taiwan

Hui-Ming Chu