Semiconductor Components Industries, LLC

Hui Min Ler

Chee Hiong Chew

Soon Wei Wang

Phillip Celaya

Swee Har Khor

Tian Hing Lim

Implementations of the semiconductor package may include a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall. Implementations of the semiconductor package may include a first lead and a second lead extending from the first sidewall and a first half-etched tie bar directly coupled to the first lead. An end of the first half-etched tie bar may be exposed on the third sidewall of the semiconductor package. Implementations of the semiconductor package may also include a second half-etched tie bar directly coupled to the second lead. An end of the second half-etched tie bar may be exposed on the fourth sidewall. An end of the first lead and an end of the second lead may each be electroplated. The first die flag and the second die flag may be electrically isolated from the first lead and the second lead.

Semiconductor package with wettable flank and related methods

Semiconductor package with wettable flank

In one embodiment, methods for making semiconductor devices are disclosed.

Semiconductor devices and methods of making the same

Growing community of inventors

Seremban, Malaysia

Hui Min Ler