Siliconware Precision Industries Co., Ltd.

Hui-Min Huang

Chun-Tang Lin

Yih-Jenn Jiang

Jung-Pang Huang

Kuan-Wei Chuang

Chien-Wei Lee

Yen-Ping Wang

A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.

Fabrication method of semiconductor package

A semiconductor structure includes a chip, a plurality of metal posts disposed in the chip and a buffer layer disposed on the chip. The chip includes a silicon-based layer having opposite first and second surfaces, and a build-up structure formed on the first surface of the silicon-based layer consisting of at least a metal layer and a low-k dielectric layer alternatively stacked on one another. Each of the metal posts is disposed in the silicon-based layer with one end thereof electrically connected with the metal layer while the other end is exposed from the second surface of the silicon-based layer. The buffer layer is disposed on the build-up structure. By positioning the low-k dielectric layer far from the second surface that is used for connecting to an external electronic component, the present invention reduces the overall thermal stress.

Semiconductor device and fabrication method thereof

Semiconductor package and fabrication method thereof

Growing community of inventors

Taichung, Taiwan

Hui-Min Huang