Samsung Electronics Co., Ltd.

Hui-Jung Kim

Yoosang Hwang

Kiseok Lee

Hyun-Woo Chung

Bong-Soo Kim

Kang-Uk Kim

Hyun-gi Kim

Yong-Chul Oh

Keunnam Kim

Junsoo Kim

Jae-man Yoon

Min Hee Cho

Satoru Yamada

Yoo Sang Hwang

Yoo-Sang Hwang

Sunghee Han

Yongchul Oh

Taehyun An

Daeik Kim

Wonsok Lee

Myeong-Dong Lee

Sung-Hee Han

Jiyoung Kim

Eunjung Kim

Sangho Lee

Yong Kim

Makoto Yoshida

Kyung Hwan Lee

Ki-Seok Lee

Hyeongsun Hong

Se-Myeong Jang

Sang-Il Han

Junhyeok Ahn

Jae Ho Hong

Seokhan Park

Jae-Rok Kahng

Hyun-Ju Sung

Keun Nam Kim

Hunkook Lee

Joongchan Shin

Hyungeun Choi

Kyupil Lee

Kyu Jin Kim

Kyu Hyun Lee

Eunju Cho

Jongmin Kim

Woo Young Choi

Jae-Man Yoon

Taejin Park

Chan-Sic Yoon

Dongoh Kim

Ki Seok Lee

Sangyeon Han

Seok Han Park

Hyo-Sub Kim

Kyujin Kim

Chang-Hoon Jeon

Jae Hyun Yoon

Jae-Hwan Cho

Woojin Jeong

Il Gyu Kim

Dong-Gun Park

Tae Jin Park

Kyunghwan Lee

Chul Ho Lee

Yongseok Kim

Dongsuk Shin

Jun Soo Kim

Eun-Jung Kim

Dongsoo Woo

Dong-Han Lee

Sung-Min Park

Seok H Lee

Yong-chul Oh

Jihun Lee

Sohyun Park

Wooyoung Choi

Keun-Nam Kim

Soo-Yong Kim

Kyoung-Ho Jung

Jin-Hwan Chun

Sung Hee Han

Hokyun An

Woun-suck Yang

Inkyoung Heo

Hyeong-Seok Jeong

Hyung-Ki Ahn

Jun-Hyeok Ahn

Chan Min Lee

Changkyu Kim

Jae-Hong Chang

Hongjun Lee

Jeong-Yeol Bae

Iljae Shin

Ahram Lee

Gyul Go

Gyung Hyun Yoon

Eui Jun Cha

Han Seong Shin

Keun-nam Kim

A semiconductor memory device is disclosed. The semiconductor memory device may include a bit line extending in a first direction, a word line extending in a second direction perpendicular to the first direction, a channel pattern between the bit line and the word line, the channel pattern including a horizontal channel portion, which is connected to the bit line, and a vertical channel portion, which is extended from the horizontal channel portion in a third direction perpendicular to the first and second directions, and a gate insulating pattern between the word line and the channel pattern. The horizontal channel portion of the channel pattern may be disposed parallel to a fourth direction that is inclined to the first and second directions.

Semiconductor memory device

A semiconductor device includes a cell active pattern including a first portion and a second portion that are spaced apart from each other; a gate structure between the first portion and the second portion of the cell active pattern; a bit-line contact on the first portion of the cell active pattern; a connection pattern on the second portion of the cell active pattern; and a cell separation pattern in contact with the bit-line contact and the connection pattern, wherein the cell separation pattern includes a first sidewall in contact with the connection pattern and a second sidewall in contact with the bit-line contact, an upper portion of the second sidewall of the cell separation pattern is in contact with the bit-line contact, and a lower portion of the second sidewall of the cell separation pattern is spaced apart from the bit-line contact.

Semiconductor device having a cell separation pattern in contact with the bit line contact

A semiconductor memory device includes a substrate comprising an element isolation layer, a bit line that extends on the substrate in a first direction, a cell buffer insulating layer between the bit line and the substrate and comprising an upper cell buffer insulating layer and a lower cell buffer insulating layer, a lower storage contact disposed on a plurality of sides of the bit line and comprising a semiconductor epitaxial pattern, a storage pad on the lower storage contact and connected to the lower storage contact and an information storage unit on the storage pad and connected to the storage pad, wherein the upper cell buffer insulating layer is between the lower cell buffer insulating layer and the bit line, and each of the lower cell buffer insulating layer and the upper cell buffer insulating layer comprises an upper surface and a lower surface that are opposite to each other.

A semiconductor memory device includes an active portion defined by a device isolation pattern, the active portion including a first impurity region located at a center portion of the active portion and a second impurity region located at an end portion of the active portion, a word line provided on the active portion and extending in a first direction, a bit line provided on the word line and extending in a second direction crossing the first direction, a bit line contact provided between the bit line and the first impurity region of the active portion, a storage node pad provided on the second impurity region of the active portion, and a storage node contact provided on the storage node pad and at a side of the bit line.

Semiconductor memory device having an ohmic contact on the impurity regions

A semiconductor memory device includes: a device isolation pattern provided on a substrate to provide a first active portion and a second active portion; a first storage node pad disposed on the first active portion; a second storage node pad disposed on the second active portion; a pad separation pattern disposed between the first and second storage node pads; a word line disposed in the substrate to cross the first and second active portions; a bit line disposed on the pad separation pattern and crossing the word line; a buffer layer disposed on the pad separation pattern; and a mask polysilicon pattern interposed between the buffer layer and the bit line, wherein a side surface of the mask polysilicon pattern is substantially aligned to a side surface of the bit line, and the mask polysilicon pattern is vertically overlapped with the pad separation pattern.

A semiconductor memory device including a substrate including an active pattern that includes a first source/drain region and a second source/drain region; an insulating layer on the substrate; a line structure on the insulating layer and extending in a first direction to cross the active pattern, the line structure penetrating the insulating layer on the first source/drain region and including a bit line electrically connected to the first source/drain region; and a contact spaced apart from the line structure and electrically connected to the second source/drain region, wherein the bit line includes a first portion vertically overlapped with the first source/drain region; and a second portion vertically overlapped with the insulating layer, and wherein a lowermost level of a top surface of the first portion of the bit line is at a level lower than a lowermost level of a top surface of the second portion of the bit line.

A semiconductor memory device may be provided. The semiconductor memory device may include a bit line, a channel pattern on the bit line, the channel pattern including a horizontal channel portion, which is provided on the bit line, and a vertical channel portion, which is vertically extended from the horizontal channel portion, a word line provided on the channel pattern to cross the bit line, the word line including a horizontal portion, which is provided on the horizontal channel portion, and a vertical portion, which is vertically extended from the horizontal portion to face the vertical channel portion, and a gate insulating pattern provided between the channel pattern and the word line.

Semiconductor memory device including symmetrical channel patterns and wordlines

A semiconductor device and a method for fabricating the same is provided. The semiconductor device includes a lower semiconductor film, a buried insulating film, and an upper semiconductor film which are sequentially stacked; an element isolation film defining an active region inside the substrate and including a material having an etching selectivity with respect to silicon oxide; a first gate trench inside the upper semiconductor film; a first gate electrode filing a part of the first gate trench; a second gate trench inside the element isolation film; and a second gate electrode filling a part of the second gate trench, a bottom side of the element isolation film being inside the lower semiconductor film.

Semiconductor device including element isolation film and method for fabricating the same

A semiconductor memory device includes active regions including first impurity regions and second impurity regions, word lines on the active regions and extended in a first direction, bit lines on the word lines and extended in a second direction crossing the first direction, the bit lines being connected to the first impurity regions, first contact plugs between the bit lines, the first contact plugs being connected to the second impurity regions, landing pads on the first contact plugs, respectively, and gap-fill structures filling spaces between the landing pads, top surfaces of the gap-fill structures being higher than top surfaces of the landing pads.

Semiconductor memory device and method of fabricating the same

A semiconductor memory device includes a stack including a plurality of layers vertically stacked on a substrate, each of the layers including a bit line extending in a first direction and a semiconductor pattern extending from the bit line in a second direction crossing the first direction, a gate electrode along each of the semiconductor patterns stacked, a vertical insulating layer on the gate electrode, a stopper layer, and a data storing element electrically connected to each of the semiconductor patterns. The data storing element includes a first electrode electrically connected to each of the semiconductor patterns, a second electrode on the first electrode, and a dielectric layer between the first and second electrodes. The stopper layer is between the vertical insulating layer and the second electrode.

A semiconductor memory device including: a stack structure including a plurality of layers that are vertically stacked on a substrate, each of the plurality of layers including a word line, a channel layer, and a data storage element electrically connected to the channel layer; and a bit line that vertically extends on one side of the stack structure, wherein the word line includes: a first conductive line that extends in a first direction; and a gate electrode that protrudes in a second direction from the first conductive line, the second direction intersecting the first direction, wherein the channel layer is on the gate electrode, and wherein the bit line includes a connection part electrically connected to the channel layer.

Semiconductor memory device and a method of fabricating the same

A semiconductor device is provided. The semiconductor device includes a first stacked structure including a plurality of first insulating patterns and a plurality of first semiconductor patterns alternately stacked on a substrate, the first stacked structure extending in a first direction parallel to an upper surface of the substrate, a first conductive pattern on one side surface of the first stacked structure, the first conductive pattern extending in a second direction crossing the upper surface of the substrate, and a first ferroelectric layer between the first stacked structure and the first conductive pattern, the first ferroelectric layer extending in the second direction, wherein each of the first semiconductor patterns includes a first impurity region, a first channel region and a second impurity region which are sequentially arranged along the first direction.

Semiconductor device

A semiconductor memory device in which performance and reliability are improved, and a method for fabricating the same are provided. The semiconductor memory device includes a conductive line extending in a first direction on a substrate, an interlayer insulation film that includes a cell trench extending in a second direction intersecting the first direction, on the substrate, a first gate electrode and a second gate electrode that are spaced apart from each other in the first direction and each extend in the second direction, inside the cell trench, a channel layer that is inside the cell trench and is electrically connected to the conductive line, on the first gate electrode and the second gate electrode, and a gate insulation layer interposed between the first gate electrode and the channel layer, and between the second gate electrode and the channel layer.

Semiconductor memory devices and methods for fabricating the same

A semiconductor memory device includes a stack structure including a plurality of layers vertically stacked on a substrate. Each of the plurality of layers includes a first dielectric layer, a semiconductor layer, and a second dielectric layer that are sequentially stacked, and a first conductive line in the second dielectric layer and extending in a first direction. The device also includes a second conductive line extending vertically through the stack structure, and a capacitor in the stack structure and spaced apart from the second conductive line. The semiconductor layer includes semiconductor patterns extending in a second direction intersecting the first direction between the first conductive line and the substrate. The second conductive line is between a pair of the semiconductor patterns adjacent to each other in the first direction. An end of each of the semiconductor patterns is electrically connected to a first electrode of the capacitor.

Semiconductor memory devices

Semiconductor memory devices are provided. A semiconductor memory device includes an isolation layer in a first trench and a first gate electrode portion on the isolation layer. The semiconductor memory device includes a second gate electrode portion in a second trench. In some embodiments, the second gate electrode portion is wider, in a direction, than the first gate electrode portion. Moreover, in some embodiments, an upper region of the second trench is spaced apart from the first trench by a greater distance, in the direction, than a lower region of the second trench. Related methods of forming semiconductor memory devices are also provided.

Growing community of inventors

Seongnam-si, South Korea

Hui-Jung Kim