Shanghai Micro Electronics Equipment (group) Co., Ltd.

Hui Fu

Bin Zhao

Xingxing Wang

Zhijun Huo

Yuangen Yu

Feixiang Shang

A vacuumizing device includes a vacuum chamber, a bonding fixture and a vacuumizing system. The bonding fixture is disposed in the vacuum chamber and includes a substrate table provided with a plurality of grooves for retention of the substrate by suction. The vacuumizing system is disposed in communication with both the vacuum chamber and grooves. During vacuumizing by the vacuumizing system, a vacuum value in the grooves is smaller than or equal to a vacuum value in the vacuum chamber. In the vacuumizing device and methods, the vacuumizing system is used to vacuumize the grooves in the substrate table and the vacuum chamber so that the vacuum value in the grooves is always smaller than or equal to that in the vacuum chamber. As a result, the substrates are firmly retained on the substrate table without warping, thereby improving the quality of substrate bonding.

Vacuumizing device and vacuumizing method for bonding substrate

A bonding device includes a flexible platen disposed between an upper platen assembly () and a transmission device and within a vacuum chamber (). The flexible platen can expand to apply a downward pressure to the upper platen assembly () connected thereto. Under the effect of the pressure, the upper platen assembly () slowly moves downward until the upper platen assembly () itself and a lower platen assembly () respectively come into tight contact with objects to be bonded. After that, the flexible platen continues exerting the downward pressure on the upper platen assembly (). In this way, the pressure applied by the upper platen assembly () to the objects to be bonded is uniform. Meanwhile, because of slow expansion of the flexible platen, the uniform pressure is applied slowly by the upper platen assembly ().

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Shanghai, China

Hui Fu