Jds Uniphase Corporation

Agere Systems Guardian Corp.

Hui Fu

Robert K Wolf

William K Hogan

James Kevin Plourde

Fridolin L Bosch

Erji Mao

Chris Hart

Heino Bukkems

Anthony T Yesenofski

The invention relates to a compact transmitter optical sub-assembly (OSA), which can be used in small form factor optical transceivers. To limit back reflections from entering the laser cavity, the laser is disposed on a silicon optical bench (SiOB) at an acute angle to the longitudinal axis of the OSA. A portion of the light from the laser cavity passes through the back end of the laser cavity for measuring by a monitor photodiode. A rear beam steering lens redirects the portion of light into a v-groove in the SiOB and off of a reflective surface formed in the end thereof to the monitor photodiode, which is positioned face down over the v-groove.

Compact optical sub-assembly

An optical transmitter includes a header, a hybrid subassembly, a laser mounted on the header, a laser driver mounted on the hybrid subassembly, and an air trench formed between the header and the hybrid subassembly.

Air trench that limits thermal coupling between laser and laser driver

A method of positioning a heat generating component on a header to enhance heat sinking characteristics includes positioning the header on a first pedestal, wherein the first pedestal and the header are bounded by an air trench having a vertical surface, and positioning the heat generating component only in areas on the header having an associated heat dissipation conical region extending from the heat generating component downward through the first pedestal at an angle that satisfies Fourier's Law of Heat Conduction, wherein the conical region does not intersect the vertical surface of the air trench.

Method for improving heat dissipation in optical transmitter

A reconfigurable laser header assembly, wherein either an n-doped laser substrate structure or a p-doped laser substrate structure can be properly biased, includes a header coupled to a modulated electric (AC) current source, a DC positive bias electric current source, and a DC negative electric current source. A laser is mounted relative to the header, the laser includes a base electric contact and a laser electric contact. An electrical conductor on the header includes first and second metalized regions in electrical connection with the base electric contact, wherein different ones of the modulated electric current source, the bias electric current source, and the DC negative electric current source can be electrically connected to the first metalized region, the second metalized region, and the laser electric contact to properly bias the laser regardless of whether the laser is an n-doped laser substrate structure or a p-doped laser substrate structure.

Reconfigurable laser header

An electronic package is adapted to be coupled in a single-ended configuration and in a differential configuration. The package provides a characteristic impedance of approximately 50 ohms when configured in a single-ended mode and also when configured in the differential mode. The package includes multiple terminals, which are coupled to ground, S, and {overscore (S)}. The package may be configured externally by the user for either mode. The package may also be fabricated to be coupled in either the differential mode or single-ended mode for user specific applications.

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Allentown, PA, United States of America

Hui Fu