Stmicroelectronics Gmbh

Hui Chong Vince Ng

Olivier Le Neel

Calvin Leung

The present disclosure is directed to an integrated circuit having a substrate and a first and a second interconnect structure over the substrate. Each interconnect structure has a first conductive layer over the substrate and a second conductive layer over the first conductive layer. The integrated circuit also includes a thin film resistor over a portion of the substrate between the first and the second interconnect structure that electrically connects the first conductive layers of the first and second interconnect structures.

Growing community of inventors

Singapore, Singapore

Hui Chong Vince Ng