Other

Hui-Ching Yang

Yi-Ming Chang

Po-Shen Lin

Chuan-Jin Shiu

Chiung-Lin Lai

An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.

Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same

Growing community of inventors

Zhongli, Taiwan

Hui-Ching Yang