Taiwan Green Point Enterprises Co., Ltd.

Hui-Ching Chuang

Pen-Yi Liao

Wen-Chia Tsai

Chih-Hao Chen

Jing-Yi Yang

Yu-Chuan Lin

Ai-Ling Lin

Yao-Tsung Ho

Yu-Cheng Chen

Hung-San Pan

A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Catalytic ink comprising metallic material made from diamminesilver hydroxide, and uses thereof

An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Illumination assembly, method of manufacturing the illumination assembly, and backlight module including the illumination assembly

A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

Method of forming patterned metal unit, and patterned article formed with the same

Catalyst for a catalytic ink and uses thereof

Illumination assembly, method of manufacturing the Illumination assembly, and backlight module including the illumination assembly

A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.

Circuit-and-heat-dissipation assembly and method of making the same

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Taichung, Taiwan

Hui-Ching Chuang