Osram Opto Semiconductors Gmbh

Hui Chiang Teoh

Choo Kean Lim

Choon Kim Lim

Wing Yew Wong

Tomin Liu

Mei See Boon

Hui Ying Pee

Asliza Alias

Lay Teng Tan

Yuan Liang

Alex Kheng Hooi Lim

In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

The invention refers to a light emitting device including a semiconductor chip having a main radiation surface, which emits UV light in operation, a phosphor, which is arranged in the radiation beam of the UV light, absorbs partially the UV light, wherein the phosphor converts the UV light into visible light so that the device emits mixed light comprising the UV light as well as visible light.

Light-emitting device and method of producing a light-emitting device

Growing community of inventors

Jitra, Malaysia

Hui Chiang Teoh