Applied Materials, Inc.

Ebay, Incorporated

Hui Chen

Shou-Sung Chang

Jianshe Tang

Haosheng Wu

Hari N Soundararajan

Chih Chung Chou

Brian J Brown

Paul D Butterfield

Zhepeng Cong

Alexander John Fisher

Xinning Luan

Jeonghoon Oh

Benjamin Cherian

Martin Jeffrey Salinas

Roy Leon Camp

Surajit Kumar

Ashur J Atanos

Chad Pollard

Kirk Allen Fisher

Frederik Van Voorden

Shaofeng Chen

Gireesh Sreepathi

Ningzhuo Cui

Shawn Joseph Bonham

James M Amos

Philip Michael Amos

Aimee S Erhardt

Frederick Van Voorden

Huy D Nguyen

A substrate support assembly and processing chamber having the same are disclosed herein. In one embodiment, a substrate support assembly is provided that includes a body. The body has a center, an outer perimeter connecting a substrate support surface and a backside surface. The body additionally has a pocket disposed on the substrate support surface at the center and a lip disposed between the pocket and the outer perimeter. A layer is formed in the pocket of the substrate support surface. A plurality of discrete islands are disposed in the layer, wherein the discrete islands are disposed about a center line extending perpendicular from the substrate support surface.

Layer with discrete islands formed on a substrate support

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

In-situ conditioner disk cleaning during CMP

An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

Steam treatment stations for chemical mechanical polishing system

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

Method for CMP temperature control

Apparatus and method for CMP temperature control

An apparatus, method, and system for identifying and obtaining information related to a substrate support and/or a pre-heat ring in a process chamber via imaging and image processing. In an embodiment, a substrate support is provided. The substrate support generally includes a top surface configured to receive a substrate in a process chamber and a marking feature disposed on the top surface of the substrate support, the marking feature configured to be detectable by an imaging apparatus coupled to the process chamber to provide information related to the substrate support via imaging when the substrate support is disposed within the process chamber.

Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging

Systems and methods for centralized client application management are provided. In an example embodiment, a client state is received from a mobile device at a management device. The client state comprises information about a particular application. A first instruction for the mobile device is generated by one or more hardware processors. The first instruction comprises an instruction to the mobile device to prevent user interaction with a user interface of a particular application. The first instruction is communicated to the mobile device, and the mobile device performs the first instruction to prevent user interaction with the user interface of the particular application.

Centralized client application management

A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.

Temperature-based in-situ edge assymetry correction during CMP

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San Jose, CA, United States of America

Hui Chen