Delphi Technologies, Inc.

Hugh R Hunkeler

Lee R Hinze

Steven L Sailor

Duane Donald Fortune

James Frank Patterson

A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Stand-off mounting apparatus for discrete electrical components

A child seat and a method for monitoring installation of the child seat are provided. The child seat includes a child seat frame configured to receive a child occupant. The child seat frame is configured to receive a seat belt webbing for securing the child seat frame to a vehicle seat. The child seat further includes a first bladder configured to contact the seat belt webbing. The first bladder has a fluid therein. The child seat further includes a first pressure sensor fluidly communicating with the fluid in the first bladder. The first pressure sensor is configured to output a first signal indicative of an amount of pressure in the first bladder. The child seat further includes a controller coupled to the child seat frame configured to receive the first signal and to compute a first tension value based on the first signal. The controller is further configured to generate a second signal to induce a first device disposed on the child seat frame to indicate when the first tension value is less than a first predetermined tension value.

Child seat and method for monitoring installation of the child seat

An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric material and contains protrusions for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component and the support.

Electronic component assembly

A module is mounted to a object with a fastener and a special washer. The fastener engages the object through a mounting opening in mounting portion of a module case. The washer has a first portion extending obliquely outward and downward to be deformed between the fastener head and an electrically non-conducting surface of the mounting portion and thus increase a mounting force on the module with mounting advancement of the fastener. The washer has a second portion extending axially into the internal opening to contact an electrically conducting insert therein and thus create a series electrical circuit from the typically grounded object through the fastener, washer and insert to a detecting circuit, which verifies that the module is securely mounted with a predetermined mounting force.

Module assembly with mounting integrity detection including deformable washer

A circuit board is inserted into an open-ended housing and potting material is dispensed onto the exposed face of the circuit board in a single step to seal the circuit board to the housing. One or more electrical interconnects such as a connector header or a ribbon cable attached to the circuit board extend upward through the potting material so that the potting material also forms an environmental seal around the electrical interconnects.

Method of manufacturing a sealed electronic module

A sealed electronic module is manufactured by forming a housing that is open at one end, dispensing a first quantity of potting material into the housing via the open end, inserting a circuit board and electrical connector assembly into the housing so that the inboard end of the circuit board is immersed in the potting material, and dispensing a second quantity of potting material into an area bridging the connector assembly and the housing. When cured, the first quantity of potting material attaches the inboard end of the circuit board to the housing, and the second quantity of potting material attaches the connector to the housing and environmentally seals the module.

Growing community of inventors

Kokomo, IN, United States of America

Hugh R Hunkeler