Chengdu Boe Optoelectronics Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hufei Yang

Bin Wang

Hao Sun

Liang Gao

Xiaoxia Huang

Feifan Li

Ajuan Du

Enjian Yang

Shuang Zhang

Dong Wang

Yongle Wang

Yang Wang

Bowen Xiao

Xuerui Gong

Fengping Wu

Weihong Wu

Xing Peng

Yilun Zeng

Yiqian Wu

Guodong Zeng

A circuit board structure and a display device, the circuit board structure includes a first circuit board, a second circuit board, a filling portion and an electromagnetic shield layer. The second circuit board has a thickness greater than that of the first circuit board. At least one corner portion forms at a joint of the first circuit board and the second circuit board. A connection line forms at a joint of the second circuit board and the first circuit board. The connection line is located at the corner portion. The filling portion fills the corner portion, an extending direction of the filling portion is identical to an extending direction of the corner portion. The extending direction is identical to a direction of the connection line. A thickness of a cross section of the filling portion perpendicular to the extending direction increases as a distance from the second circuit board decreases.

Circuit board structure and display device

A heat dissipation film for a display module, and a preparation method of a display device. The heat dissipation film comprises a composite structure layer and a removable protective film disposed on the composite structure layer. The composite structure layer has a first side surface and a second side surface disposed opposite to each other, and is provided with a preconfigured hole passing through the first side surface and the second side surface. The first side surface of the composite structure layer adheres to a side of the display module facing away from a display side. The protective film is attached to the second side surface of the composite structure layer. The protective film is provided with a shielding region covering the preconfigured hole. The shielding region and the rest of the protective film can all be independently torn off from the composite structure layer.

Heat dissipation film for display module, and preparation method of display device

A flexible support plate is configured to support a display panel, and is provided with a bendable region. The bendable region has at least one boundary line extending in a first direction, and the boundary line is part of a side of the flexible support plate. A plurality of hollows are arranged at intervals in the bendable region, the plurality of hollows are divided into a plurality of hollow groups arranged in the first direction, and each hollow group includes at least one hollow. For any boundary line, any one of the plurality of hollow groups has one boundary point, the boundary point is disposed on a contour line of a hollow in the hollow group to which the boundary point belongs, and the boundary point has a smallest distance from a corresponding boundary line in the contour line to which the boundary point belongs.

Flexible support plate, and method for manufacturing same

A display module includes a display panel, a flexible circuit board, a driving control chip, a touch control chip and a protective structure. The flexible circuit board is bonded to the display panel. The driving control chip is located on the display panel or the flexible circuit board. The touch control chip is located on the flexible circuit board or the display panel. The protective structure covers the driving control chip and/or the touch control chip. And the protective structure includes a first insulating layer, a heat dissipation layer and an electromagnetic shielding layer that are sequentially disposed away from the display panel.

Display module and display device

A Chip-On-Film structure, a displaying base plate and a displaying device, wherein the Chip-On-Film structure includes a first substrate; a plurality of driving chips provided on one side of the first substrate, and a plurality of first leads that are connected to the plurality of driving chips; and the plurality of first leads are for binding a displaying base plate, and a quantity of the first leads is greater than or equal to a sum of quantities of channels of the plurality of driving chips.

Chip-on-film structure, displaying base plate and displaying device

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Beijing, China

Hufei Yang