Lite-on Semiconductor Corporation

Huei-Jen Chen

Evan Liu

Yvon Chen

A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-layer rigid PCB. A portion of the multi-layer rigid PCB between the grooves is milled to expose a corresponding portion of the soft PCB to define an exposed area. The combined PCB is drilled through along two opposite sides of the grooves and the corresponding exposed area of the soft PCB. Breakable parts are formed at a center of the corresponding portion of the soft PCB and two opposite outside edges of the grooves.

Method for fabricating a substrate, including a plurality of chip package substrates

A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

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YungHo, Taiwan

Huei-Jen Chen