Wistron Neweb Corporation

Huei-Chi Wu

Cheng-Hsiung Lu

Yi-Chieh Lin

San-Yi Kuo

Man-Ning Lu

Yu-Cheng Yu

An electronic device is provided. The electronic device includes a substrate, a connector, a ground bracket and a conductive structure. The substrate includes a ground layer. The connector is disposed on the substrate, wherein the connector includes a metal frame. The ground bracket is affixed on the substrate and coupled to the ground layer, wherein at least a portion of the connector is located in the ground bracket. The conductive structure is adapted to abut the metal frame and to abut the ground bracket, wherein when the conductive structure connects the metal frame to the ground bracket, the conductive structure electrically connects the ground bracket to the metal frame.

Electronic device with conductive structure directly abutting metal frame to ground bracket

A connector including a conductive casing, a terminal, a first insulation structure and a conductive structure is provided. The conductive casing has an inner wall. The terminal includes a first section and a second section. The first section is disposed in the conductive casing, and the first section and the inner wall have a gap therebetween. The second section is located outside the conductive casing. The first insulation structure is disposed between the first section and the inner wall. The conductive structure is electrically connected to the conductive casing and has an inclined plane. The inclined plane is aligned to the second section, the second section and the inclined plane have a gap therebetween, and the inclined plane is parallel to a extending direction of the second section. In addition, a printed circuit board module having the connector is also provided.

Growing community of inventors

Hsinchu, Taiwan

Huei-Chi Wu