Siemens Aktiengesellschaft

Hubert Zukier

Hans Hadersbeck

Hans J Hacke

Fritz Mueller

Alfred Groeber

A method for the manufacture of fine structures for semiconductors were in a photographic structuring is carried out on both sides of a smooth, non-stressed metal tape. The tape is etched from both sides. A single sided metal deposition than takes place by means of a float type electroplating. Stabilization of the fine structure is achieved by depositing a lacquer or resin by an electrophoretic deposition or by electro-immersion lacquering. The insulator carrier is applied as one of the final steps of the process.

Manufacture of fine structures for semiconductor contacting

A printed circuit board has temperature-stable electric components, such as resistance networks, disposed on the soldering side of the circuit board. The components mounted on the soldering side of the board are mounted as a unit containing the network, which unit has a recess which partially surrounds the solder connection location of the circuit board, at which point the unitary component is electrically and mechanically connected to the board. The recesses are beveled to facilitate solder flow, and cover approximately half of the connection location of the circuit board.

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Munich, Germany

Hubert Zukier