Conti Temic Microelectronic Gmbh

Continental Automotive Gmbh

Schweizer Electronic Ag

Vitesco Technologies Gmbh

Hubert Trageser

Bernhard Schuch

Friedrich Nehmeier

Alexander Neumann

Hermann-Josef Robin

Ferdinand Friedrich

Helmut Heinz

Jürgen Sauerbier

Juergen Sauerbier

Wolfgang Gruebl

Wolfgang GRÜBL

A circuit board (&#x2033;) includes at last one insulating substrate layer (SL, SL, SL, SL, SL) and a plurality of electrically conductive copper coats (C, C, C) arranged on the at least one insulating substrate layer (SL, SL, SL, SL, SL), wherein at least one of the electrically conductive copper coats (C, C, C) is coated at least on both sides with a layer (HSI, HS, HS) made of a material for inhibiting electromigration, wherein on a layer (HS, HS) made of a material for inhibiting electromigration a further metal layer (M, M, M, M') is provided, which is in turn coated with a further layer (HS, HS&#x2032;) made of a material for inhibiting electromigration.

Circuit board and method for production thereof

A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170&#xb0; C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.

Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller

A circuit board () has a top face () for positioning an electronic component and a bottom face () used as a support on a heat-dissipating base. A plurality of heat transfer holes () provide heat transfer from the top face () to the bottom face (). The heat transfer holes () are unevenly or non-uniformly distributed on the top face () in such a way that the top face () is provided with several free sectors () which are free of heat transfer holes () in order to connect the electronic component to the circuit board (). The free sectors () are configured as columns or lines. A plurality of heat transfer holes () are placed at least along the long sides of the free sectors (). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.

Printed circuit board

Electronic packages are produced as follows. Vias in a support body are closed with a highly viscous screen printing material following application of a first metallizing layer forming a base metallization on the support body and in the lead-throughs for the vias. A low viscosity passivating layer, which has been applied on the entire surface of the top and bottom sides of the support body, is selectively removed from certain areas of the top side. A second metailizing layer forming the final metallization of a low-melting point material is applied to the first metallization layer in the areas from which the passivating layer was removed. Electronic components of the circuit arrangement are applied on the top side of the support body and contacted by a soldering process.

Method for the production of an electronic component

Growing community of inventors

Igensdorf, Germany

Hubert Trageser