Dr. Ing. H.c. F. Porsche Aktiengesellschaft

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Hubert Rauh

Patrick Fuchs

Maximilian Barkow

Timijan Velic

Maximilian Hofmann

Jordan Sorge

Bernd Eckardt

Andre Mueller

Benjamin Bayer

A power semiconductor module includes a first and second insulating substrate, which is arranged parallel to and at a distance from the first insulating substrate. The first insulating substrate and the second insulating substrate each include an insulating layer, an inner metallization layer, and an outer metallization layer. The power semiconductor module also includes a first cooling device, which is arranged thermally conductively on the outer metallization layer of the first insulating substrate, a second cooling device, which is arranged thermally conductively on the outer metallization layer of the second insulating substrate. The power semiconductor module also includes a power semiconductor, arranged between the first insulating substrate and the second insulating substrate. At least one of the two insulating substrates include a through-contact, by which the inner metallization layer of the corresponding insulating substrate is electrically connected to the outer metallization layer of the corresponding insulating substrate.

Power semiconductor module

A liquid-cooled power electronics unit includes a planar circuit board body having conductor tracks, a wet side with a wet space for carrying a dielectric cooling liquid, and a fluidically, separated dry side, wherein at least two high-voltage power semiconductors are arranged on the circuit board body on the wet side within the wet space, the high-voltage power semiconductors being cooled by the cooling liquid, and an electronic low-voltage circuit is arranged on the dry side of the circuit board body.

Liquid-cooled power electronics unit

Growing community of inventors

Erlangen, Germany

Hubert Rauh