Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Hubert Piontek

Anton Schnegg

Werner Zulehner

Peter Hahn

Silicon wafers and a process for the production thereof which produces was having intrinsic gettering action and on which thin oxide layers with high breakdown strength can be produced. During the production, the wafers are subjected to a treatment which smooths the wafer surface, for example, by repolishing, after the intrinsic getters have been produced in the interior of the wafer. Oxide layers subsequently deposited are outstanding for an increased breakdown strength compared with untreated wafers.

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Burgkirchen, Germany

Hubert Piontek