Henkel-teroson Gmbh

Henkel Kommanditgesellschaft Auf Aktien

Henkel Ag & Company, Kgaa

Loctite (r&d) Limited

Loctite Corporation

Hubert K Schenkel

Rainer Schoenfeld

Barry N Burns

Olaf Lammerschop

Rajat K Agarwal

Peter Born

Jonathan P Wigham

Harald Kuester

Martin J Fitzpatrick

Matthew James Holloway

Norman E Blank

Mary B Ward

Juergen Von Czarnecki

Matthias Von Hayek-Boelingen

Rajat Agarwal

This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.

Epoxy compositions having improved impact resistance

Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries. Such compositions are particularly suitable as impact-resistant, impact/peel-resistant and peel-resistant adhesives in vehicle construction and in electronics. Particularly at very low temperatures, these adhesives exhibit very good impact and peel properties combined with very good corrosion resistance and ageing resistance of the adhesive bond.

Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide

The introduction of vibration energy such as ultrasound into an uncured adhesive matrix during and/or after the joining of substrates leads to the effective dissolution and/or dispersion of adhesion-reducing contamination of the substrate surfaces into the adhesive matrix. In many cases, this can reduce the cost of expensive cleaning processes or quality control measures.

Process for bonding contaminated substrates

A high strength adhesive having a good impact strength at low temperatures, below 0&deg; C., and at temperatures of 90&deg; C. is provided. The adhesive comprises a copolymer having at least one glass transition temperature of &minus;30&deg; C. or lower having epoxy reactive end groups or a reaction product of the copolymer with a polyepoxide, a reaction product of a polyurethane prepolymer and a polyphenol or polyaminophenol and at least one epoxy resin.

Impact-resistant epoxide resin compositions

One-component, heat-curing reactive compositions based on liquid rubbers containing reactive olefinic double bonds and optionally solid rubbers and vulcanization systems based on sulfur have high maxima of the acoustic loss factor over a broad in-use temperature range of around &plus;10&deg; C. to &plus;40&deg; C. in their vulcanized state. These compositions optionally contain fine-particle thermoplastic polymers as an additional component. The compositions are suitable for use as acoustically damping adhesives, sealing compounds or coating compositions.

Method for reducing mechanical vibration in metal constructions

A reactive hot melt adhesive contains, as resin component, a reaction product of

Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol

Growing community of inventors

Sandhausen, Germany

Hubert K Schenkel