Institut National D'optique

Indigo Systems Corporation

National Optics Institute

Hubert Jerominek

Christine Alain

Alain Bergeron

Nicholas R Swart

Martin Renaud

Nichola Desnoyers

James T Woolaway

William A Terre

Hassane Oulachgar

Francis Picard

Patrice Topart

Samir Ilias

Philip Mauskopf

Martin Bolduc

An uncooled microbolometer detector that includes a substrate, a platform held above the substrate by a support structure, at least one thermistor provided on the platform, and an optical absorber. The optical absorber includes at least one electrically conductive layer extending on the platform over and in thermal contact with the at least one thermistor and patterned to form a resonant structure defining an absorption spectrum of the uncooled microbolometer detector. The optical absorber is exposed to electromagnetic radiation and absorbs the electromagnetic radiation according to the absorption spectrum. A microbolometer array including a plurality of uncooled microbolometer detectors arranged in a two-dimensional array is also provided. Advantageously, these embodiments allow extending the absorption spectrum of conventional infrared uncooled microbolometer detectors to the terahertz region of the electromagnetic spectrum.

Uncooled microbolometer detector and array for terahertz detection

There are provided a method and a system for illuminating one or more target in a scene. An image of the scene is acquired using a sensing device that may use an infrared sensor for example. From the image, an illumination controller determines an illumination figure, such that the illumination figure adaptively matches at least a position of the target in the image. The target is the selectively illuminated using an illumination device, according to the illumination figure.

Selective and adaptive illumination of a target

High-resolution imaging systems are provided. In one embodiment, an imaging system based on a Cassegrain or Schmidt-Cassegrain objective, with coaxial primary and secondary mirrors, is provided with a microdisplacement mechanism acting on the secondary mirror to displace the image on a focusing array. In another embodiment, two co-axial Cassegrain-type objectives are provided one within the other with a common focal plane array, which therefore detects combined wide field-of-view and narrow field-of-view images.

Optical imaging system for obtaining multi-field-of-view image

High-resolution optical imaging systems

A light modulator comprises a mirror, a substrate provided with at least one electrode, and at least one hinge extending between the substrate and the mirror. The mirror is flexible with the hinge being displaceable for allowing for the displacement and/or the deformation of the mirror. Typically, there are two symmetrically disposed hinges, each including upper and lower arms that define an angle therebetween. The upper arm is connected to the mirror, and the lower arm is mounted to the substrate. The upper and lower arms are adapted to pivot relative to one another thereby allowing the angle to vary and thus allowing the mirror to at least one of displace and deform. When unbiased, the mirror may be plane, convex or concave. When biased, the plane mirror adopts a curved attitude, whereas the curved mirror changes its curvature. The upper and lower arms of each hinge are V-shaped and define an apex. The apexes extend inwardly in a facing relationship.

Light modulating microdevice

The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Miniature microdevice package and process for making thereof

In a microbolometer detector the individual transducers in the focal plane array are support by leg members that are attached to the underlying readout integrated circuit (ROIC) chip at locations underneath transducers other than transducer which they support. A variety of configurations are possible. For example, the leg members may be attached to the ROIC chip at locations under adjacent transducers on opposite sides or on the same side of the supported transducer, or at locations underneath transducers that are not immediately adjacent to the supported transducer. In this way the effective length of the leg members and therefore the thermal isolation of the transducer they support can be increased.

Microbolometer detector with high fill factor and transducers having enhanced thermal isolation

A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming the microplatform and forming a flexible hinge member for hingedly connecting the microplatform to the support member and allowing relative movement of the microplatform with respect to the support member. This microdevice, when compared to prior art devices, can have improved mechanical strength, rigidity, low deformation, and high planarity.

Process for making microdevice with movable microplatform

The method of fabricating a suspended microstructure with a sloped support, comprises the steps of (a) providing a member having three stacked up layers including a first substrate layer, a second temporary layer and a third photoresist layer; (b) photolithographically transferring a sloped pattern to the third photoresist layer by means of a grey scale mask; (c) etching the second layer through the third layer resulting from step (b) to obtain a surface with at least one continuous slope with a predetermined angle with respect to the first substrate layer; (d) depositing a fourth layer on the previous layers; (e) etching the fourth layer to obtain the sloped support; (f) (i) depositing a fifth planarization layer, (ii) depositing a sixth layer, and (iii) etching the sixth layer; and (g) removing the second layer and the fifth layer to obtain the suspended microstructure with the sloped support. The invention is also concerned with a suspended microstructure fabricated by the method.

Method of fabricating a suspended micro-structure with a sloped support

The microbridge structure comprises a substrate layer provided with two first electrical contacts; a microstructure including a sensing area provided with two second electrical contacts; and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support has two electrically conductive paths made of electrically conductive layers. The two electrically conductive paths connect respectively the two first electrical contacts of the substrate layer to the two second electrical contacts of the microstructure. The micro support extends generally underneath the microstructure, between the microstructure and the substrate layer. The invention also relates to a method for forming the microbridge structure.

Microbridge structure and method for forming the microbridge structure

The microbridge structure comprises a substrate layer provided with two first electrical contacts, a microstructure provided with two second electrical contacts, and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support extends along a vertical axis. The micro support has a central upper cavity extending along the vertical axis within the micro support. The micro support has a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer. The micro support is a multilayer micro support comprising two conductive paths and a layer made of dielectric material. The conductive paths and the layer of the micro support extend from the upper end to the lower end thereof. The two conductive paths connect respectively the two first contacts to the two second contacts. The present invention is also concerned with a method for forming a microstructure suspended by a micro support.

Microbridge structure and method for forming a microstructure suspended

The invention relates to spatial light modulators (SLM) for amplitude and phase modulation of incident light. A 'flexure' hinge which is provided between the SLM's substrate and micromirror comprises integral hinged sections which allow for the micromirror to tilt or to move in a piston-like fashion relative to the substrate in response to an electrostatic force. The hinge is particularly advantageous for large mirrors. In addition, the hinge can provide improved heat sinking capability over previously reported SLM hinge designs based on torsion bars and cantilever beams. The flexure hinge has sufficient mechanical flexibility that the SLM actuation voltage required is not excessively high. The flexure hinge has many applications, the preferred ones being a SLM for modulating high-energy beams and a SLM for optical channel switching.

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Sainte-Foy, Canada

Hubert Jerominek