Brown, Boveri & Cie Ag

Asea Brown Boveri Ag

Hubert Hettmann

Arno Neidig

Bernd Leukel

Altan Akyurek

Altan Aky/u/ Rek

A power semiconductor module and method for producing the module includes a plastic housing having a lower surface. An electrically insulating substrate having an upper surface is inserted in the lower surface of the plastic housing for supporting electrical components. A metallization is disposed at least on the upper surface of the substrate. The metallization on the upper surface of the substrate is patterned to form conductor tracks. Components are soldered onto the patterned metallization. Locating compartments disposed in the plastic housing form a soldering jig for the components during production of the module.

Power semiconductor module and method for producing the module

Rectifier module, including a frame forming a housing wall and having an open top and bottom, a ceramic plate cemented to the frame forming a housing bottom and having a side facing the interior of the housing and a side facing away from the interior of the housing, metallizations disposed on the side of the ceramic plate facing the interior of the housing forming conductor strips for soldering on semiconductor components, internal connecting straps, external connecting elements in the form of flat plugs having a broadened base part being soldered to one of the metallizations, an actual plug connector part being freely accessible from the top of the housing and an extension curve being disposed between the base part and the actual plug connector, the extension curve having a cross-sectional area being smaller than the cross-sectional area of the base and actual plug connector parts, a sealing compound filling substantially half of the housing, and a copper foil being disposed on the side of the ceramic plate facing away from the interior of the housing and having a thickness being substantially the same as the thickness of the metallizations.

Rectifier module

In this static converter module, which is equipped with thyristors, diodes or power transistors, mounting lugs (4,11) having mounting holes (5,6,12,13) are used for mounting the module on a heat sink. The housing of the module is essentially formed by a frame (1,10) which is open at the top and at the bottom and by a ceramic plate which is inserted into the base part of the frame. For the purpose of fixing the ceramic plate in place, a peripheral indentation (7,15) is provided in the base part of the frame. In order to prevent mechanical stresses in the area of the mounting holes/mounting lugs from being transmitted to the ceramic plate, slits (9) are provided between the frame walls and the mounting holes. As an alternative to this, the peripheral indentation (15) can be provided with steps in such a manner that in the area of the two frame walls provided with the mounting lugs (11) a slot-shaped recess (16) is produced between the ceramic plate and the peripheral indentation (15).

Static converter module with mounting lugs

Connecting strap for electrically connecting a contact of a semiconductor component to a conductor run, including a bracket having two doubly bent ends, soldering lugs integral with the ends of the bracket, and lateral wings integral with one of the doubly bent ends of the bracket for connection to a conductor run.

Growing community of inventors

Hockenheim, Germany

Hubert Hettmann