Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Hubert A Vander Plas

Matthew K Schwiebert

Robert E Kraft

Matthew Heydinger

Donald T Campbell

Frank Berauer

David A Champion

Gregory Scott Herman

Alfred I-Tsung Pan

David M Schut

Jacques Leibovitz

Barry Craig Snyder

Susan J Swindlehurst

Ron Allen Hellekson

A photonic-crystal filament is formed by mixing a slurry comprising particles of substantially uniform size and a precursor material for a desired metal, urging the slurry through an orifice to force the particles and precursor material into a combination having a desired crystallographic configuration, drying the combination emerging from the orifice, and sintering the precursor material.

Photonic-crystal filament and methods

A method for depositing a solder layer or solder bump on a sloped surface. The method includes etching a sloped surface on a planar semiconductor substrate, depositing a solder-wettable layer on the sloped surface, masking the wettabler layer with a coating layer to control the position of the solder deposition, and using an organic film to prevent the solder from being deposited at regions not above either the wettable layer or the coating layer. Also, a semiconductor device structure on which a solder layer or solder bump is formed exclusively on a sloped surface.

Solder on a sloped surface

An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.

Multiple redundant through hole electrical interconnects and method for forming the same

A method of forming solder bumps on a wafer. The wafer includes at least one substrate, a plurality of solder-wettable pads and a solder wettable retention ring about the periphery of the wafer. The method of forming solder bumps includes forming a non-solder-wettable mask on the wafer which includes a plurality of apertures which align with the solder-wettable pads, and the solder wettable retention ring surrounds the mask. The mask and wafer are positioned within an aperture of a stencil so that the solder wettable retention ring aligns with a gap between the periphery edge of the mask and an inside edge of the aperture of the stencil. Solder paste is applied to the mask so that the solder paste fills the apertures of the mask and the gap. The solder paste is reflowed forming solder bumps on the pads and a solder ring on the solder wettable retention ring. The mask is removed after formation of the solder bumps.

Solder retention ring for improved solder bump formation

A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Method of bumping substrates by contained paste deposition

Method of making solder balls by contained paste deposition

A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls

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Palo Alto, CA, United States of America

Hubert A Vander Plas