Zte Corporation

Huazhang Cao

Bi Yi

Yingxin Wang

Changgang Yin

Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body () of a circuit board includes a hole () enclosed by a conductive layer in the main body (), the conductive layer constitutes a wall () of the hole (), and a dielectric filling layer (), which has a dielectric constant smaller than that of the main body (), is disposed between at least a portion of the wall () of the hole () and the main body (), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

Growing community of inventors

Guangdong, China

Huazhang Cao