Inventec Corp.

Inventec (pudong) Technology Corporation

Huang-Cheng Ke

Chih-Kai Yang

Feng-Ku Wang

Yu-Chih Cheng

Hua-Feng Chen

Cheng-Shang Chou

An electronic device includes a case, a control module, a plurality of heat sinks and at least one airflow guiding structure. The case includes a bottom plate, a top plate, and at least one side plate. The bottom plate has a plurality of bottom holes for guiding air into the case. The top plate has a plurality of top holes for exhausting air in the case. The side plate connects the top plate and the bottom plate and has a plurality of side holes for exhausting air in the case. The control module is disposed in the case. The heat sinks are thermally connected to the control module. The airflow guiding structure is disposed between the heat sinks for guiding a part of the air in the case to the exterior of the case through the side holes.

Electronic device with phase change material microcapsule layer

A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.

Heat dissipation module

A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.

Growing community of inventors

Taipei, Taiwan

Huang-Cheng Ke