Azurewave Technologies, Inc.

Huang-Chan Chien

Chung-Er Huang

An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance.

Inter-stage test structure for wireless communication apparatus

A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers.

Module IC package structure and method for manufacturing the same

A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate and a grounding layer disposed inside the circuit substrate. The grounding layer is exposed from the outer surrounding peripheral surface of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The electronic components are electrically connected to the grounding layer through the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate. The metal shielding layer directly contacts the grounding layer, thus the electronic components are electrically connected to the metal shielding layer through the grounding layer.

Module IC package structure

A filtering apparatus and method for dual-band sensing circuit are disclosed. The invention features a dual-band sensing unit disposed in a filtering device that receives the signals from a sub-system with variable frequency spectrum. The signals are split up into several bands. After that, one or more frequency detecting units are used to detect the power of high-band and low-band signals, and convert the power into a voltage signal. Users can externally adjust the gain of a tunable gain amplifier for the voltage signal. Further, a comparison operation is processed by a comparator, and a signal resulted from the comparison operation is used to control the switch timing for an RF switching unit. Consequently, this like adaptive notch filter is achieved to determine the intensity of noise and thereby to turn on the high-band or low-band notch filters, so as to reduce the in-band loss.

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Taipei, Taiwan

Huang-Chan Chien