Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Garuda Technology Co., Ltd.

Huan-yu He

Biao Li

Mei-Hua Huang

Jin-Cheng Wu

A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

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Shenzhen, China

Huan-yu He