United Microelectronics Corp.

Huan-Ting Tseng

Chun-Hsien Huang

Benjamin Szu-Min Lin

Chun-Chi Yu

Chen-Wei Lee

Bo-Jou Lu

Yong-Fa Huang

Hung-Chin Huang

A method of manufacturing doping patterns includes providing a substrate having a plurality of STIs defining and electrically isolating a plurality of active regions in the substrate, forming a patterned photoresist having a plurality of exposing regions for exposing the active regions and the STIs in between the active regions on the substrate, and performing an ion implantation to form a plurality of doping patterns in the active regions.

Method of manufacturing doping patterns

To avoid the yield of wafers that undergo immersion lithography influencing by delay of post exposure baking (PEB), an operation system adjusts a speed of inputting the wafers to undergo immersion lithography according to a status of wafers that have finished exposure and are waiting for baking. Therefore, the wafers that have finished exposure are transmitted to be baked efficiently and on time.

Method and related operation system for immersion lithography

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Kao-Hsiung Hsien, Taiwan

Huan-Ting Tseng