Chipbond Technology Corporation

Huan-Kuen Chen

Chen-Yu Wang

Wen-I Hsieh

Pai-Sheng Cheng

Te-Cheng Yang

In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.

Electronic package and method of manufacturing the same

A tray cleaning apparatus having a top plate, a bottom plate, a first bearing plate assembly and a second bearing plate assembly. The first bearing plate assembly disposed between top plate and bottom plate comprises a first supporting plate, plural first blocks and plural second blocks, the first supporting plate comprises an inner surface having a first disposing area and a second disposing area. The first blocks are disposed at the first disposing area and the second blocks are disposed at the second disposing area. The second bearing plate assembly disposed between top plate and bottom plate comprises a second supporting plate, plural third blocks and plural fourth blocks, the second supporting plate comprises an outer surface having a third disposing area and a fourth disposing area. The third blocks are disposed at the third disposing area and the fourth blocks are disposed at the fourth disposing area.

Growing community of inventors

Taichung, Taiwan

Huan-Kuen Chen