Asml Netherlands B.v.

Huaichen Zhang

Maurits Van Der Schaar

Maxim Pisarenco

Marie-Claire Van Lare

A method for applying a deposition model in a semiconductor manufacturing process. The method includes predicting a deposition profile of a substrate using the deposition model; and using the predicted deposition profile to enhance a metrology target design. The deposition model can be calibrated using experimental cross-section profile information from a layer of a physical substrate. In some embodiments, the deposition model is a machine-learning model, and calibrating the deposition model includes training the machine-learning model. The metrology target design may include an alignment metrology target design or an overlay metrology target design, for example.

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Eindhoven, Netherlands

Huaichen Zhang