Opto Tech Corporation

Huai-Ku Chung

Chien-Chen Hung

Cheng-Wei Yang

Shih-Han Yu

Shun-Lih Tu

Hung-Tung Wang

Chih-Hung Chuang

Chia-Feng Yang

Tsu-An Han

According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

LED array package structure and method thereof

A light emitting element array module includes a board; a silicon base having a first side, a second side opposite to the first side and adhered to the board, a third side having a first angle with the second side, a fourth side substantially in parallel with the first side and having a second angle with the third side, and a fifth side having a third angle with the fourth side; a chip having a first main surface formed with at least one light emitting element array and at least one pad array, and a second main surface adhered to the board; a driving device adhered to the first side of the silicon base; and a plurality of metal wires for connecting the pad array to the driving device.

Light emitting element array module and printer head and micro-display using the same

Growing community of inventors

Hsinchu, Taiwan

Huai-Ku Chung